LK Automation Limited
Brand:
OMRON
C200HW-BC081-V1 CPU Backplane
OMRON C200HW-BC081-V1 Product information and technical parameters：
Brand: OMRON
Name: CPU Backplane
Model: C200HW-BC081-V1
No. of I/O slots: 8 slots.
C200H-CPU01-E/C200H-CPU03-E CPUs
High Spec, Small Rack Style,
OEM Version The C200H-CPU01-E and C200H-CPU03-E controllers offer big machine functions in a system designed ideally for basic OEM systems from 50 to 480 I/O.
A wide variety of plug-in style I/O modules are available,
including intelligent modules C200HW-BC081-V1. Used to attach Hand-held Programming Console to a panel.1 set (2 included) C200HW-BC081-V1Model: C200H-MR832.
Description: RAM, 8K words, capacitor back-up.no clock.Name: SYSMAC LINK Module.
Model: C200HW-SLK13.
Communications method: N: N token bus.
Transmission method: Manchester code, base band.
Transmission path: Daisy chain.
Weight: 500g max.Name: SYSMAC LINK Co-axial Power Supply.
Model: C200HS-SLK22 C200HW-BC081-V1.
UM: 15.2K words.
DM: 6K words.
EM: 6K words.
Instruction processing time (basic instructions): 0.15 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.Model: C200H-B7AO1.
I/O points: 16 output points.
Weight: 200g max C200HW-BC081-V1. C200HW Communications Interface Module C200HW-PRM21Name: Temperature Sensor Module.
Model: C200H-TS102.
Temperature sensor: RTD (Pt 100 Ω.)(DIN/1989 JIS).
Input points: 4 points/Unit max. (1, 2, or 4 points can be selected).Model: C200H-MD501.
No. of I/O pts: 16 inputs, 16 outputs.
Specifications: 5 VDC.Name: Heat/Cool Temperature Control Module.
Model: C200H-TV103.
Sensor: Platinum resistance thermometer: JPt100, Pt100.
Control output: Current output(transistor output used for cooling outputs).UM: 31.2K words.
DM: 6K words.
EM: 6Kx3 bannks(18K) words C200HW-BC081-V1.
Instruction processing time (basic instructions): 0.1 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unaavailable C200HW-BC081-V1.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.Name: Host Link Module.
Model: C200H-LK101-PV1.
Communication ports: 1 fiber port.
High Spec, Small Rack Style,
OEM Version The C200H-CPU01-E and C200H-CPU03-E controllers offer big machine functions in a system designed ideally for basic OEM systems from 50 to 480 I/O.
A wide variety of plug-in style I/O modules are available,
including intelligent modules C200HW-BC081-V1. Used to attach Hand-held Programming Console to a panel.1 set (2 included) C200HW-BC081-V1Model: C200H-MR832.
Description: RAM, 8K words, capacitor back-up.no clock.Name: SYSMAC LINK Module.
Model: C200HW-SLK13.
Communications method: N: N token bus.
Transmission method: Manchester code, base band.
Transmission path: Daisy chain.
Weight: 500g max.Name: SYSMAC LINK Co-axial Power Supply.
Model: C200HS-SLK22 C200HW-BC081-V1.
UM: 15.2K words.
DM: 6K words.
EM: 6K words.
Instruction processing time (basic instructions): 0.15 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.Model: C200H-B7AO1.
I/O points: 16 output points.
Weight: 200g max C200HW-BC081-V1. C200HW Communications Interface Module C200HW-PRM21Name: Temperature Sensor Module.
Model: C200H-TS102.
Temperature sensor: RTD (Pt 100 Ω.)(DIN/1989 JIS).
Input points: 4 points/Unit max. (1, 2, or 4 points can be selected).Model: C200H-MD501.
No. of I/O pts: 16 inputs, 16 outputs.
Specifications: 5 VDC.Name: Heat/Cool Temperature Control Module.
Model: C200H-TV103.
Sensor: Platinum resistance thermometer: JPt100, Pt100.
Control output: Current output(transistor output used for cooling outputs).UM: 31.2K words.
DM: 6K words.
EM: 6Kx3 bannks(18K) words C200HW-BC081-V1.
Instruction processing time (basic instructions): 0.1 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unaavailable C200HW-BC081-V1.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.Name: Host Link Module.
Model: C200H-LK101-PV1.
Communication ports: 1 fiber port.
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